As vehicles become increasingly connected and driving is transformed by sophisticated ADAS and autonomous driving technologies, key trends are impacting the need for more efficient thermal management across automotive electronic components, including miniaturization, systems integration and more powerful processing.
In addition to meeting reliability and safety standards, OEMs and component suppliers must also meet requirements for high production demand and improved sustainability, while ensuring high performance.
Henkel's next generation of thermal gap fillers are helping meet these needs through solutions tailored specifically for demanding automotive applications. Join this Webinar to learn more about how Henkel’s BERGQUIST Gap Filler TGF 4400LVO is addressing these evolving requirements through fast-dispensing speed, thin bond-line thickness, excellent wet-out, good dielectric strength, high adhesive strength and more.
Speakers:
Dylan Hayenga
Application Engineer, Thermal Automotive Components, North America
Henkel
Dylan Hayenga is an Application Engineer in the Thermal Interface Material technology team for Henkel Corporation North America, responsible for supporting customers with Henkel's thermal technologies, and supporting adhesive development projects for new thermal interface materials hitting the market. Hayenga is passionate about the latest polymer material technologies, thermal management of e-mobility and automotive electronics applications, and building new relationships in the industry.
Hayenga earned a Bachelor's in Composite Materials Engineering, along with a Polymer Chemistry focus at Winona State University located in Winona, MN.
Hayenga currently resides in Minneapolis, MN
