Today, semiconductors cannot be manufactured without using machine vision. Machine vision has made it possible to achieve the density in today’s integrated circuits and to manufacture them cost-effectively. Semiconductor manufacturers rely on Cognex machine vision, barcode readers, and AI-powered technology to ensure precise alignment of wafers during masking and etching processes, increase traceability of wafers and die as they move through the front and backend processes, and improve product quality through advanced inspection procedures.

Semiconductor manufacturing requires ultra-high precision. Die densities have steadily increased over the years. Today’s semiconductors have features sized at the nanometer level, which requires ultra-high precision and alignment when performing fabrication processes, such as photolithography, dicing, wire bonding, and packaging. Cognex alignment solutions help maximize yield, improve quality, and lower costs by using industry-leading machine vision tools to locate and align patterns and fiducials quickly and precisely, even under adverse conditions.